Core Competency / Capabilities

Engineering
Excellence

15+ years of precision PCB fabrication. From prototype to high-volume production, FQC delivers multilayer, HDI, heavy-copper, and high-speed low-loss PCBs under nine ISO/IECQ/IATF certifications.

FQC automated PCB handling robot

Manufacturing Specs

REF-SPEC-2026
Multilayer Rigid
Max Layers80L / 100L
Board Thickness0.20-6.0 mm / 0.15-6.5 mm
Aspect Ratio25:1 / 30:1

80L in 2026 / 100L in 2027 roadmap

Advanced HDI
Build-Up Order4+N+4 / 5+N+5
Min Laser Via0.075 mm / 0.05 mm
HDI Max Layers12L Any-Layer
Heavy Copper
Max copper 202615 oz
Max copper 202720 oz
Primary ApplicationsEV · Solar Inverters
High-Speed / Low-Loss
MaterialsMegtron 6/7/8 · Rogers
Impedance Tolerance±7% / ±5%
Network analyzer43G / 67G
Detailed Specification

Full spec sheet.

Parameter20262027Notes
Max layers80L100LTechnology roadmap
Board thickness0.20-6.0 mm0.15-6.5 mmMin / max board thickness
Min L/S (inner layer)0.035/0.035 mm0.025/0.025 mmProduction design rule
Min L/S (outer layer)0.035/0.035 mm0.025/0.025 mmProduction design rule
Min mechanical drill0.10 mm0.10 mmMechanical holes
Min laser via0.075 mm0.05 mmHDI
Max aspect ratio25:130:1Mechanical through-hole
Impedance tolerance±7%±5%High-speed / high-frequency
Max copper thickness15 oz20 ozHeavy copper
HDI build-up4+N+45+N+5Any-Layer HDI
Working panels720 × 620 mm720 × 620 mmProcess input size
Delivery panels690 × 590 mm690 × 590 mmDelivery panel support

Source: First Quality Circuit Company Profile technical capability table

Engineering Tools

Spec the board before you quote.

IPC-2141 / 2152 / A-600 compliant interactive calculators and selectors. Four bench-side tools, all running inline on this page.

01

Material comparison matrix

Select the laminate first. Its Er, loss, thermal behavior, and availability drive both the stackup and impedance result.

MaterialFamilyErtanDTgTdLeadBest fit
Shengyi FR-4Standard FR-44.200.0200180340StockedStandard multilayer, industrial control
Nanya FR-4High-Tg FR-44.100.0180170340StockedAutomotive and industrial multilayer
ITEQ IT-180AMid-loss FR-44.200.0200180340StockedGeneral multilayer and FA control
KB High-Tg FR-4High-Tg FR-44.100.0180180340StockedAutomotive, power and industrial control PCB
Isola FR408HRHigh-speed FR-43.700.0090180360Stocked10+ Gbps signal integrity
Panasonic Megtron 6/7Low-loss3.700.0040185400+1-2 weeks28/56 Gbps SerDes and server backplane
Rogers RO4350BHydrocarbon ceramic3.660.0037280390+2 weeksRF / microwave below 40 GHz
TUC High-SpeedHigh-speed laminate3.800.0060200390+1-2 weeksCommunication and optical module PCB
Wazam High-TgHigh-Tg laminate4.000.0120180360By RFQCustomer-controlled multilayer stackups
EMC BT / High-TgBT / high-Tg laminate4.200.0120180350By RFQPackage substrate and customer-specified materials
Selected
Shengyi FR-4
Dk / Df
4.20 / 0.0200
Thermal
Tg 180 C
Moisture
0.13%

Dk/Df/Tg/Td are planning values for pre-RFQ comparison. Final values follow the customer-specified datasheet and approved stackup.

PDF Downloads

Attach these to your design review before engineering sync.

All calculations trace to IPC-2141 / IPC-2152 / IPC-A-600.

Quality Certifications

Nine international standards.

Nine internationally recognized standards covering quality, environment, safety, and industry-specific requirements. These are not marketing — they are the gate requirements for serving specific industries.

9 Active · Automotive · Medical · Aerospace · Info-Security · Halogen-Free

Quality System Headline

IATF 16949+ISO 13485+QC 080000

Only PCB manufacturer in its regional peer set qualified for automotive (IATF 16949), medical (ISO 13485), and hazardous-substance management (QC 080000) simultaneously — the three certifications most factories never hold together.

IATF 16949

Automotive Quality Management

Every board traceable to process parameters required by tier-1 auto suppliers. Bosch, Continental, Denso-grade QMS expectations. PPAP Level 3 capability.

ISO 13485

Medical Device Quality

Design and production controls meeting FDA QSR and EU MDR. Class II/III medical electronic assemblies. MES-enabled lot traceability.

QC 080000

Hazardous Substance Process Management

Full RoHS/REACH/halogen-free traceability. Required by all major Japanese FA vendors and the EU market. Process-level substance management.

Certifications

9

Industries Covered

7

Earliest Since

2015

Audit Cycle

3 YR

Each card links to the standard's official registrar reference
A
IATF 16949:2016

Automotive Quality

AutomotiveStandard
View Certificate

Official certification scan issued via parent fsqualitypcb.com

M
ISO 13485:2016

Medical Devices QMS

View Certificate

Official certification scan issued via parent fsqualitypcb.com

H
IECQ QC080000:2017

Hazardous Substance Process Management

Halogen-FreeStandard
View Certificate

Official certification scan issued via parent fsqualitypcb.com

Q
ISO 9001:2015

Quality Management

FoundationalStandard
View Certificate

Official certification scan issued via parent fsqualitypcb.com

E
ISO 14001:2015

Environmental Management

EnvironmentStandard
View Certificate

Official certification scan issued via parent fsqualitypcb.com

S
ISO 45001:2018

Occupational Health & Safety

View Certificate

Official certification scan issued via parent fsqualitypcb.com

I
ISO/IEC 27001:2022

Information Security

View Certificate

Official certification scan issued via parent fsqualitypcb.com

C
ISO 14064:2018

Greenhouse Gas Emissions

View Certificate

Official certification scan issued via parent fsqualitypcb.com

V
EN 9100:2018

Aerospace Quality

Aerospace (EU)Standard
View Certificate

Official certification scan issued via parent fsqualitypcb.com

Materials Supported

Qualified base materials.

Base material suppliers include Shengyi, Nanya, Panasonic, ITEQ, KB, Rogers, Isola, Wazam, TUC, and EMC. Other materials can follow customer specification.

ShengyiNanya (Taiwan)PanasonicITEQKBRogers RO4350BIsola FR408HRWazamTUCEMC

The Fabrication Lifecycle

Every board moves west-to-east through a single 12-station flow. Each station is gated against ISO/IATF process parameters before advancing.

12 Stations9 Certifications
01

CCL Cutting

Copper-clad laminate sheet cutting from raw stock.

CCL Cutting MachineRaw material feed
02

Inner-Layer LDI Imaging

Direct laser imaging of inner-layer circuits.

LDI / Auto DeveloperMin 2 mil trace
03

DES Line

Develop, etch, and strip of inner layers.

DES Auto LineClosed-loop etchant control
04

Inner AOI

100% automated optical inspection of each panel.

AOI StationsFull-panel inspection
05

Brown Oxidation

Copper surface treatment before multilayer bonding.

Brown Oxidation BayBond-strength prep
06

Vacuum Lamination

Multilayer stack bonding under heat and pressure.

Vacuum Lamination PressProgrammable thermal profile
07

Drilling (Mechanical + Laser)

Through-hole and microvia drilling.

CNC Drill + CO₂/UV LaserMech 6 mil · laser 3 mil
08

Chemical Plating

Desmear and electroless copper deposition.

Chemical Plating LineThrough-hole continuity
09

Electroplating (VCP)

Vertical continuous plating for copper thickness.

VCP Electroplating Line25:1 / 30:1 AR
10

Solder Mask + Cure

Photoimageable solder resist apply and cure.

Solder Mask LineLDI-exposed
11

Legend Printing

Reference-designator inkjet printing.

Legend Inkjet PrinterNon-contact
12

Outline → E-Test → AVI/FQC

V-cut/rout, 4-wire flying-probe e-test, AVI + X-ray final, packaging.

V-cut / 4-wire FP / AVI / X-ray100% electrical test

The Equipment Stack

A single 406 × 60 m production building houses the full 12-station line. 24 robotic arms handle inter-process transfer — boards never leave the line.

CCL Cutting Machine
01CCL Cutting Machine
DES Auto Line
02DES Auto Line
Brown Oxidation
03Brown Oxidation
Vacuum Lamination Press
04Vacuum Lamination Press
Mechanical + Laser Drilling
05Mechanical + Laser Drilling
Chemical Plating Line
06Chemical Plating Line
VCP Electroplating Line
07VCP Electroplating Line
Solder Mask Line
08Solder Mask Line
Legend Inkjet Printer
09Legend Inkjet Printer
Outline Rout / V-Cut
10Outline Rout / V-Cut
4-Wire Flying Probe E-Test
114-Wire Flying Probe E-Test
AVI / X-ray Final QC
12AVI / X-ray Final QC
Surface Finish · 100% In-House

ENIG · ENEPIG · HASL · OSP · Imm Tin · Gold plating — all 8 processes run in-house at Rayong.

Learn more → Surface Finish Portfolio

Lead time / capacity

Four-week production window

Demo / sample data

Snapshot of weekly booking status. Contact sales to hold a production slot.

Week 1LIMITED

Week of Apr 19

Limited availability

Week 2OPEN

Week of Apr 26

Available

Week 3FULL

Week of May 3

Full — taking next-week orders

Week 4OPEN

Week of May 10

Available

Real-time capacity data refreshed every Monday. Contact sales to hold production slot.

Spec locked? Request a quote.

All calculations trace to IPC-2141 / IPC-2152 / IPC-A-600.